Journal
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
Volume 47, Issue 1, Pages 10-16Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TEMC.2004.842204
Keywords
power and ground-plane noise; quality factor; radiation loss; via coupling
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An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered in this model. The radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. The quality factors associated with three loss mechanisms are calculated and compared. The effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss printed circuit boards. Measurements are performed to validate the effectiveness of this model.
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