Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 15, Issue 2, Pages 394-399Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/15/2/020
Keywords
-
Ask authors/readers for more resources
This paper reports a new solder bonding method for the wafer level packaging of MEMS devices. Electroplated magnetic film was heated using induction heating causing the solder to reflow. The experiment results show that it took less than 1 min to complete the bonding process. In addition, the MEMS devices experienced a temperature of only 110 degreesC during bonding, thus thin film materials would not be damaged. Moreover, the bond strength between silicon and silicon wafer was higher than 18 MPa. The step height of the feed-through wire (acting as the electrical feed-through of the bonded region) is sealed by the electroplated film. Thus, the flatness and roughness of the electroplated surface are recovered by the solder reflow, and the package for preventing water leakage can be achieved. The integration of the surface micromachined devices with the proposed packaging techniques was demonstrated.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available