Optimization of hot-press conditions of Zn4Sb3 for high thermoelectric performance.: II.: Mechanical properties

Mechanical properties including Young's modulus, Vickers hardness, 3-point bending strength, and fracture toughness, were evaluated for p-type semiconductive thermoelectric Zn4Sb3 hot-pressed at four different temperatures ranging from 738 K to 753 K in order to study the effect of sintering temperature. Young's modulus increased linearly from 58 GPa to 76 GPa with increasing sintering temperature. The hardness exhibited a similar proportional relation, ranging from 1.4 GPa to 1.6 GPa. The bending strength and fracture toughness were 56-70 MPa and 0.64-0.7 MN m(-3/2), respectively. Based on experimental data, the anticipated thermal stress was estimated for a Zn4Sb3 component assembled in a thermoelectric power generator. (C) 2004 Elsevier B.V. All rights reserved.