Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 15, Issue 4, Pages 728-735Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/15/4/009
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The elastic and failure mechanical properties of hydrogen-free tetrahedral amorphous carbon (ta-C) MEMS structures were investigated via in situ direct and local displacement measurements by a method that integrates atomic force microscopy (AFM) with digital image correlation (DIC). On-chip MEMS-scale specimens were tested via a custom-designed apparatus that was integrated with an AFM to conduct in situ uniaxial tension tests. Specimens 10 mu m and 50 mu m wide and of 1.5 mu m average thickness were used to measure the elastic properties while 340 mu m wide tension specimens with a central elliptical perforation resulting in a stress concentration factor of 27 were tested to investigate local effects on material strength. The Young's modulus, Poisson's ratio and tensile strength were measured as 759 +/- 22 GPa, 0.17 +/- 0.03 and 7.3 +/- 1.2 GPa, respectively. In an effort to understand the effect of local defects and assess the true material strength, the local failure stress at sharp central elliptical notches with a stress concentration factor of 27 was measured to be 11.4 +/- 0.8 GPa. The AFM/DIC method provided for the first time local displacement fields in the vicinity of microscale perforations and these displacement fields were in accordance with those predicted by linear elasticity.
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