IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic NiBGA substrate

The interfacial reaction, morphology of intermetallic compound (IMC) and shear strength between the Sn-3.5Ag-0.7Cu (in wt.%) solder and Ni ball grid array (BGA) substrates during reflow at 255 degrees C for up to 20 min were investigated. The reaction between the molten solder and Ni layer resulted in the formation of two IMCs such as (Cu, Ni)(6)Sn-5 and (Ni, Cu)(3)Sn-4 at the interface. The (Ni, Cu)(3)Sn-4 IMCs were needle-like type, while the (Cu, Ni)(6)Sn-5 IMCs were cylinders with a hexagonal cross-section and pointed tips. Compared to the quenched sample, the (Cu, Ni)(6)Sn-5 IMCs nucleated heterogeneously on the (Ni, Cu)(3)Sn-4 layer during the solidification of the solder. In the ball shear test, the shear strength value did not change much as a function of reflow time. In all samples, the fracture occurred in the bulk solder. The results of interfacial reaction and shear test in this study show that the Sn-Ag-Cu/Ni BGA solder joint has a desirable joint reliability. (c) 2004 Elsevier B.V. All rights reserved.