Journal
IEEE JOURNAL OF SOLID-STATE CIRCUITS
Volume 40, Issue 6, Pages 1350-1359Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSSC.2005.848029
Keywords
APS; CMOS image sensors; laser triangulation; machine vision; MAPP; multiresolution; multisense; smart vision sensors; 3-D
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This paper presents a multiresolution general-purpose high-speed machine vision sensor with on-chip image processing capabilities. The sensor comprises an innovative multiresolution sensing area, 1536 A/D converters, and a SIMD array of 1536 bit-serial processors with corresponding memory. The sensing area consists of an area part with 1536 x 512 pixels, and a line-scan part with a set of rows with 3072 pixels each. The SIMD processor array can deliver more than 100 GOPS sustained and the on-chip pixel-analysing rate can be as high as 4 G pixels/s. The sensor is ideal for high-speed multisense imaging where, e.g., color, greyscale, internal material light scatter, and 3-D profiles are captured simultaneously. When running only 3-D laser triangulation, a data rate of more than 20 000 profiles/s can be achieved when delivering 1536 range values per profile with 8 bits of range resolution. Experimental results showing very good image characteristics and a good digital to analog noise isolation are presented.
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