Journal
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Volume 28, Issue 2, Pages 290-296Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCAPT.2005.848487
Keywords
computer CPU cooling; heat-transfer device; loop heat pipe (LHP); thermal resistance
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Loop heat pipes (LHPs) are highly efficient heat-transfer devices, which have considerable advantages over conventional heat pipes. Currently, miniature LHPs (MLHPs) with masses ranging from 10-20 g and ammonia and water as working fluids have been developed and tested. The MLHPs are capable of transferring heat loads of 100-200 W for distances up to 300 mm in the temperature range 50-100 degrees C at any orientation in 1-g conditions. The thermal resistance for these conditions are in the range from 0.1 to 0.2 K/W. The devices possess mechanical flexibility and are adaptable to different conditions of location and operation. Such characteristics of MLHPs open numerous prospects for use in cooling systems of electronics and computer systems.
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