Self-forming diffusion barrier layer in Cu-Mn alloy metallization

Advancement of semiconductor devices requires the realization of an ultrathin diffusion barrier layer between Cu interconnect and insulating layers. The present work investigated the possibility of the self-forming barrier layer in Cu-Mn alloy thin films deposited directly on SiO2. After annealing at 450 degrees C for 30 min, a Mn containing amorphous oxide layer of 3-4 nm in thickness was formed uniformly at the interface. Residual Mn atoms were removed to form a surface oxide layer, leading to a drastic resistivity decrease of the film. No interdiffusion was detected between Cu and SiO2 within the detection limit of x-ray energy dispersive spectroscopy. (c) 2005 American Institute of Physics.