4.4 Article

Ta-Ru-N diffusion barriers for high-temperature contacts to p-type SiC

Journal

THIN SOLID FILMS
Volume 485, Issue 1-2, Pages 207-211

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2005.04.005

Keywords

SiC; diffusion barrier; Ta-Ru-N; ohmic contact

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A new diffusion barrier,. Ta-Ru-N, has been tested on ohmic contacts to p(+)-4H-SiC aged at 350 degrees C in air. Specific contact resistance measurements combined with X-ray diffraction, Auger electron spectroscopy, and X-ray photoelectron spectroscopy were used to evaluate the barriers. Upon aging, all ohmic contacts exhibited an initial change in resistance but stabilized within 100 h, with many samples surviving for 2000 h (the longest time tested). The Ru: Ta ratio in the barriers must be sufficiently high to obtain a long-lived barrier in air. Specific contact resistances as low as 3 x 10(-5), Omega cm(2) were maintained after 2000 h of aging. (c) 2005 Elsevier B.V All rights reserved.

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