On low cost inclination sensors made from selectively metallized polymer

We report on an innovative low cost concept for the fabrication of micromechanical capacitive inclination sensors. The concept based on moulded interconnect device (MID)-technology where three dimensional polymer devices are fabricated by injection moulding and covered by a structured metal layer using electroless plating and laserablation. To demonstrate the principle of operation we fabricated and characterized first demonstrator devices using standard PCBs with different electrode designs for different measurement ranges. (C) 2005 Elsevier B.V. All rights reserved.