Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 168, Issue 2, Pages 250-257Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2005.01.010
Keywords
wafer; non-uniformity; FEM; ANFIS
Ask authors/readers for more resources
In this paper, modeling of a two-dimensional axisymmetric quasic-static finite element model, in conjunction with an adaptive-network-based fuzzy inference system (ANFIS) for chemical mechanical polishing process, or CMP for short, was established. The prediction of non-uniformity on wafer surfaces under various combinations of process parameters can be achieved. The data of non-uniformity on wafer surface can be obtained under different conditions of the carrier load, the pads elastic modulus and thickness by using the developed finite element model for CMP. Three input process parameters have been used in the ANFIS model to predict the non-uniformity on wafer surfaces. In this model, three types of membership function for analysis in ANFIS training were adopted and their differences compare the accuracy rate of prediction of non-uniformity on wafer surfaces. (c) 2005 Elsevier B.V. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available