Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 15, Issue 11, Pages 2130-2135Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/15/11/019
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A technological process for wet chemical etching of microfluidical/microoptical elements in fused silica using a Cr hard mask is presented. The Cr layer is fabricated using sputter deposition under different Ar pressures to reduce the intrinsic stress in the hard mask. Stress reduction was achieved using an Ar pressure of 4.8 x 10(-3) mbar, whereas compressive and tensile stress are produced by lower or higher pressures, respectively. An etch depth of 104 mu m was achieved without detachment of the mask. The overall lithography process and etching defects caused by non-optimal fabrication parameters are also discussed. Special attention is given to the pressure during sputtering and the resulting mask quality in different stress regimes.
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