Journal
ANNUAL REVIEW OF MATERIALS RESEARCH, VOL 40
Volume 40, Issue -, Pages 531-555Publisher
ANNUAL REVIEWS
DOI: 10.1146/annurev.matsci.38.060407.130253
Keywords
microelectronic packaging; diffusion; reliability; current stressing; Joule heating; thermal gradient; underbump metallization
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Pb-free solders have replaced Pb-containing SnPb solders in the electronic packaging industry due to environmental concerns. Both electromigration (EM) and thermomigration (TM) have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. We review the unique features of EM and TM in flip-chip solder bumps, emphasizing the effects of current crowding and joule heating. In addition, the challenges to a better understanding of EM and TM in Pb-free solders are discussed. For example, the anisotropic nature of Sn microstructure in Pb-free solders can enhance the dissolution rates of Ni and Cu in solders driven by EM and TM.
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