Journal
INTERNATIONAL JOURNAL OF THERMAL SCIENCES
Volume 96, Issue -, Pages 221-226Publisher
ELSEVIER FRANCE-EDITIONS SCIENTIFIQUES MEDICALES ELSEVIER
DOI: 10.1016/j.ijthermalsci.2015.05.006
Keywords
Thermal resistance; Carbon nanotubes; Thermal conductive adhesive
Categories
Funding
- DARPA Nano-Thermal Interface Program
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Due to their high intrinsic axial thermal conductivity, carbon nanotube (CNT) arrays have generated much interest as next generation thermal interface materials. A significant barrier in their future use is CNT-substrate thermal boundary resistance. For this reason much research has been done in examining improved array adhesion methods. This paper models the thermal resistance of a novel interface structure which shows promise in achieving low thermal resistance and high mechanical compliance. Through the use of a thermal conductive adhesive attachment, overall thermal resistances below 1 mm(2) KW-1 can potentially be achieved using a vertically aligned CNT array, which will enable development of future high performance electronic packages. (C) 2015 Published by Elsevier Masson SAS.
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