Journal
APPLIED PHYSICS LETTERS
Volume 88, Issue 1, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.2158702
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We propose a kinetic model to describe a pancake-type void propagation in flip chip solder joints due to current crowding in electromigration. The divergence of the vacancy fluxes at the interface between the solder and Cu6Sn5 leads to void formation and propagation along the interface between them. Based on the continuity condition, the void growth velocity is calculated. The theoretical calculations are in reasonable agreement with the experimental results. (c) 2006 American Institute of Physics.
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