4.6 Article

Punch-through in short-channel AlGaN/GaN HFETs

Journal

IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 53, Issue 2, Pages 395-398

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2005.862702

Keywords

drain-induced barrier lowering (DIBL); GaNHEMT; GaN heterojunction field-effect transistors (HFET); punch-through; short-channel effects

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Short-channel punch-through effects are demonstrated in 0.17 mu m gate length AlGaN/GaN single heterojunction field-effect transistors. These take the form of a high output conductance and the strong dependence of pinch-off voltage on drain voltage. It is shown by simulation that they can be explained by poor confinement of charge at the AlGaN/GaN interface resulting in current How within the bulk of the GaN layer. This is caused by there being a concentration of only similar to 1.5 X 10(16) cm(-3) deep levels in the insulating GaN buffer layer. It is found that a net acceptor density of around 10(17) cm(-3) is required to ensure suppression of short-channel effects.

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