DNA-Templated copper nanowire fabrication by a two-step process involving electroless metallization

Here, we report a new fabrication method of DNA-templated copper nanowires. The copper nanowires were fabricated via two-step reactions. First, Pd(II) ions were electrostatically adsorbed onto negatively charged DNA molecules immobilized on the substrate surfaces and reduced chemically. As a result, palladium nanowires with a diameter of approximately 6 nm were obtained. Second, the palladium nanowires were dipped into a copper electroless plating bath. Electroless deposition of copper proceeded specifically on the palladium nanowires. The diameters of the copper nanowires were controlled by the plating time.