Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 420, Issue 1-2, Pages 55-62Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2006.01.065
Keywords
lead-free; solder; SnA-Cu; shear strength; aging
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Mechanical and microstructural properties of SnAgCu solder joints with hypoeutectic, eutectic and hypereutectic cornpositions were studied. Eutectic SnPb joints were used as the reference. Reflowed lap shear specimens made of FR-4 glass epoxy printed circuit boards with OSP and NiAu surface finishes were used in the tests. Mechanical properties and microstructural features of the joints were examined in the as-reflowed condition and after isothermal aging at 85 degrees C for 1000 h. Both the composition and PCB surface finish had a notable effect on the mechanical behaviour of the SnAgCu solder joints. The shear strength value of SnAgCu solder joints was mainly dependent on the size and distribution of Ag3Sn dispersions. The coarseness of the dispersions depends strongly on the amount of Ag in the solder alloy, the cooling rate after the reflow and the aging history of the solder joints. (c) 2006 Elsevier B.V. All rights reserved.
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