Journal
PROCEEDINGS OF THE IEEE
Volume 94, Issue 6, Pages 1214-1224Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JPROC.2006.873612
Keywords
integrated circuit interconnections; three-dimensional integrated circuits (3-D ICs)
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Three-dimensional integrated circuits (3-D ICS) offer significant improvements over two-dimensional circuits, and promise a solution to the severe problems that are being, and will be, encountered as monolithic process geometries are reduced to below 65 nm. Several methods associated with the fabrication of 3-D ICs are discussed in this paper, and the techniques developed by Tezzaron Semiconductor Corp., are described in detail. Four successful 3-D ICs are described, along with the anticipated benefits of applying 3-D design to future system-on-chip (SoC) devices.
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