Journal
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Volume 6, Issue 2, Pages 123-131Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDMR.2006.877865
Keywords
charge pumping (CP); charge trapping; high-k; threshold voltage instability; trap generation
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Positive bias constant voltage stress combined with charge pumping (CP) measurements were applied to study trap generation phenomena in SiO2/HfO2/TiN stacks. Using gate stacks with varying thicknesses of the interfacial SiO2 layer (IL) or high-kappa layer and analysis for frequency-dependent CP data developed to address trap depth profiling, the authors have determined that the defect generation in the stress voltage range of practical importance occurs primarily within the IL on as-grown precursor defects most likely caused by the overlaying HfO2 layer. The generated traps can be passivated by a forming gas or nitrogen (N-2) anneal, whereas a postanneal stress reactivates these defects. The results obtained identify the IL as one of the major targets for reliability improvement of high-kappa stacks.
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