Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 35, Issue 7, Pages 1581-1592Publisher
MINERALS METALS MATERIALS SOC
DOI: 10.1007/s11664-006-0152-7
Keywords
lead-free solders; intermetallic compound growth; Alloy 42
Ask authors/readers for more resources
Soldering with the lead-free tin-base alloys requires substantially higher temperatures (similar to 235-250 degrees C) than those (213-223 degrees C) required for the current tin-lead solders, and the rates for intermetallic compound (IMC) growth and substrate dissolution are known to be significantly greater for these alloys. In this study, the IMC growth kinetics for Sn-3.7Ag, Sn-0.7Cu, and Sn-3.8Ag-0.7Cu solders on Cu substrates and for Sn-3.8Ag-0.7Cu solder with three different substrates (Cu, Ni, and Fe-42Ni) are investigated. For all three solders on Cu, a thick scalloped layer of eta phase (Cu6Sn5) and a thin layer of epsilon phase (Cu3Sn) were observed to form, with the growth of the layers being fastest for the Sn-3.8Ag-0.7Cu alloy and slowest for the Sn-3.7Ag alloy. For the Sn-3.8Ag-0.7Cu solder on Ni, only a relatively uniform thick layer of eta phase (Cu,Ni)(6)Sn-5 growing faster than that on the Cu substrate was found to form. IMC growth in both cases appears to be controlled by grain-boundary diffusion through the IMC layer. For the Fe-42Ni substrate with the Sn-3.8Ag-0.7Cu, only a very thin layer of (Fe,Ni)Sn-2 was observed to develop.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available