4.7 Article

Resistance of polyimide/silica hybrid films to atomic oxygen attack

Journal

SURFACE & COATINGS TECHNOLOGY
Volume 200, Issue 24, Pages 6671-6677

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.surfcoat.2005.09.028

Keywords

atomic oxygen; hybrid materials; polyimide; sol-gel

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Polyimide/silica (PI/SiO2) hybrid films were prepared by the sol-gel process to improve the erosion resistance of polyimide materials in atomic oxygen (AO) environments. The p-aminophenyltrimethoxysilane (APTMOS) was used as a coupling agent to enhance the compatibility between the PI and SiO2. The effects of the APTMOS addition on the morphology and property of the PI/SiO2 hybrids were investigated using UV-Vis spectrophotometer, FTIR spectroscopy and SEM. The thermal properties and AO resistance of the PI/SiO2 hybrids were investigated by TGA and in the AO simulator, respectively. The results showed that the addition of APTMOS remarkably reduced the size of the silica particles, the PI/SiO2 hybrid films became transparent, and the compatibility between the PI and SiO2 and the thermal stability of the hybrids were significantly improved. During AO exposure, a passive inorganic SiO2 layer was formed on the PI/SiO2 hybrid films, causing the hybrid films to possess excellent AO resistance. The optical properties of the PI/SiO2 hybrid films were not altered after AO exposure. (c) 2005 Elsevier B.V. All rights reserved.

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