3.8 Article

Processing, characterization and photocatalytic properties of Cu doped TiO2 thin films on glass substrate by sol-gel technique

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.mseb.2006.03.038

Keywords

Cu doped TiO2 coating; sol-gel; photocatalyst

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The present paper describes processing, properties and photocatalytic application of Cu doped TiO2 thin films on glass substrate. Cu doped TiO2 coatings were successfully prepared on glass slide substrates using sol-gel method. The obtained solutions exhibit acidic characteristics. The phase structure, thermal, microstructure and surface properties of the coatings were characterized by using XRD, DTA/TG, SEM and AFM. Their adhesion properties and spectroscopic analysis were investigated by a scratch tester and UV-vis spectroscopy. Four different solutions were prepared by changing Cu/Ti ratios. Glass substrates were coated by solutions of Ti-alkoxide, Cu-chloride, glacial acetic acid and isopropanol. The obtained gel films were dried at 300 degrees C for 10 min and subsequently heat-treated at 500 degrees C for 5 min in air. The oxide thin films were annealed at 600 degrees C for 60min in air. TiO2, CuO, Cu4Ti, Ti3O5 and Cu3TiO4 phases were found in the coating. The organic matters were burned at temperatures between 200 and 350 degrees C and TiO2 crystallization was formed at 450 degrees C. The weight loss of the powder during process up to 600 degrees C is approximately 70%. The microstructural observations demonstrated that CuO content was led an improved surface morphology while thickness of the film and surface defects were increased in accordance with number of dipping. According to AFM results, it was found that as the Cu/Ti content increases the surface roughness of the films increases. In addition structural, thermal and microstructural results, it was found that the films of 0.73 ratio have better adhesion strength to the glass substrate among other coatings. The oxide films were found to be active for photocatalytic decomposition of metylene blue. (c) 2006 Published by Elsevier B.V.

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