Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 431, Issue 1-2, Pages 166-174Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2006.05.144
Keywords
Pb-free solder; low cycle fatigue; microstructure evolution; orientation imaging microscopy; finite element analysis
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Microstructural evolution in a Sn-rich eutectic Sn-3.8Ag-0.7Cu solder alloy has been investigated in low cycle mechanical fatigue. Inhomogeneity in deformation occurred on a grain scale (determined by grain orientation and plastic anisotropy of Sn) and on a subgrain scale where persistent slip bands were observed in Sn dendrites. Microcracks are formed predominantly on interfaces between the persistent slip bands and the eutectic regions within grains. Grain boundary decohesion or sliding was not observed, which is in sharp contrast to recent findings in unconstrained thermal fatigue of Sn-3.8Ag-0.7Cu. (c) 2006 Published by Elsevier B.V.
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