Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 16, Issue 10, Pages 1926-1934Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/16/10/003
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The need for a simple and effective characterization technique for thin-film materials which are widely used in MEMS (micro-electro-mechanical systems), using commonly available equipment, has prompted consideration of cantilever beam-based methods. The advantages of this class of techniques which employ a scanning surface profiler to deform micro-cantilevers are simplicity, speed, cost and wide applicability. A technique for extracting Young's modulus from static deflection data is developed in this paper and validated in experiments on thin-film specimens of silicon nitride deposited on a silicon substrate under different conditions. Finite element analysis is used to assess the influence of factors affecting the bending of thin films, and thus guide the analysis of micro-cantilever deflection data for reliable characterization of the material.
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