Journal
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS
Volume 45, Issue 10B, Pages 8228-8234Publisher
JAPAN SOC APPLIED PHYSICS
DOI: 10.1143/JJAP.45.8228
Keywords
microplasma; atmospheric pressure; wire spraying; CVD; microdeposition; plasma jet; metal oxide; reactive evaporation; tungsten oxide; patterning
Categories
Ask authors/readers for more resources
We developed a safe technique without using a toxic gas source to deposit tungsten oxide on a localized specific area using an atmospheric pressure microplasma jet. In this technique, a consumable tungsten wire, inserted into a quartz nozzle for microplasma generation, was etched with an O-2/Ar microplasma, and the resultant tungsten oxide was deposited on the substrate placed downstream. The process mechanism was determined by the detailed observation of the deposit and consumed wire surface after processing, and optical emission spectroscopy. This technique is expected to be utilized for the localized deposition of a variety of metal oxides by varying the kind of consumable metal wire.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available