Deposition profile of Ti film inside a trench and its correlation with gas-phase ionization in high-pressure magnetron sputtering

This article reports the relationship between the degree of ionization of Ti in the gas phase and the thickness profile of Ti film inside a trench in magnetron sputtering deposition. A conventional magnetron sputtering plasma source was used for depositing Ti films inside trenches formed on rf-biased SiO2 substrates. It was found that a high bottom coverage was obtained when a high gas pressure and a long distance between the target and the substrate were employed for the deposition. On the other hand, at a short distance between the target and the substrate, the bottom coverage was small and was almost independent of the gas pressure. The deposition profile was compared with the. spatial distributions of Ti and Ti+ densities measured by laser-induced fluorescence (LIF) imaging spectroscopy. The LIF results revealed that the density ratio of Ti+ to Ti in the downstream region increased with the gas pressure up to 0.3, while in the upstream region, it was small (< 0.05) and was roughly constant with the gas pressure. In the case with the enhanced density ratio of 0.3, the flux ratio of Ti+ to Ti was estimated to be 4.4. Hence, it was concluded that, with a high gas pressure and a long distance between the target and substrate, the deposition profile with a high bottom coverage was obtained by accelerating Ti+ toward the bottom of the trench. The high-pressure magnetron sputtering discharge is useful for enhancing the degree of ionization and the bottom coverage. (c) 2006 American Vacuum Society.