Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 35, Issue 12, Pages 2081-2087Publisher
MINERALS METALS MATERIALS SOC
DOI: 10.1007/s11664-006-0317-4
Keywords
lead-free solder; morphology; intermetallic compounds (IMCs)
Ask authors/readers for more resources
The morphology and grain growth pattern of intermetallic compounds (IMCs) formed between the Cu substrate and Sn-3.5Ag solder doped with a small amount of additive (0.1 mass%), say, Ni or Co, was investigated. After soldering, a duplex structure due to the additive discontinuity at the (Cu, Ni)(6)Sn-5 and (Cu, CO)(6)Sn-5 region was detected. That is, the outer area of the (Cu, Ni)(6)Sn-5 and (Cu, CO)(6)Sn-5 region on the solder side contained much higher Ni or Co additive concentration than the inner area on the Cu side. The faceted-shape IMCs were observed at the outer area, while the rounded-shape were identified at the inner area of (Cu, Ni)6Sn5 and (Cu, CO)6Sn5. Based on the thermodynamic calculation, the higher solubility of additive at the outer area will enhance the enthalpy change during interfacial reaction and lead to the larger Jackson's parameter; thus, the faceted IMC morphology was formed. Moreover, the abnormal grain growth (AGG) at the outer area of (Cu, Ni)(6)Sn-5 and (Cu, CO)(6)Sn-5 was demonstrated from the IMC grain size distribution, while the normal grain growth pattern was suggested for the inner area of the IMC region.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available