Journal
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
Volume 135, Issue 3, Pages 282-284Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.mseb.2006.08.020
Keywords
aluminium oxide; gallium nitride; metal-oxide-semiconductor structures
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We report on a GaN metal-oxide-semiconductor field-effect-transistor (MOSFET) using atomic-layer-deposited (ALD) Al2O3 as the gate dielectric. Compared to a GaN metal-semiconductor field-effect-transistor (MESFET) of similar design, the MOSFET exhibits several orders of magnitude lower gate leakage and near three times higher channel current. This implies that the ALD Al2O3/GaN interface is of high quality and the ALD Al2O3/GaN MOSFET is of interest and potential for high-power RF and digital applications. In addition, the channel mobility of n-GaN layer is similar to 414 cm(2)/V s, which has not been degraded by ALD Al2O3 growth and device fabrication. (c) 2006 Elsevier B.V. All rights reserved.
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