Journal
MATERIALS LETTERS
Volume 61, Issue 3, Pages 794-798Publisher
ELSEVIER
DOI: 10.1016/j.matlet.2006.05.062
Keywords
copper; microclectrodes; thin films; fiber technology; kinetics; electrical properties
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The initial stage of copper electrodeposition on the electrochemically activated assembly of carbon microelectrodes from an acid solution of copper sulfate was investigated using cyclic voltammetry, potentiostatic pulse technique and electrochemical impedance spectroscopy. Analysis of the experimental current transients has been carried out using a non-linear fitting procedure according to the model that takes into account spherical diffusion towards a disc-shaped microetectrode. The higher values of diffusion coefficient in comparison with those observed on planar electrodes were explained with an increased diffusion caused by the electrode geometry. Impedance spectra showed two time constants, the high-frequency related to the charge transfer process and the low-frequency corresponded to the deposit morphology. (c) 2006 Elsevier B.V. All rights reserved.
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