Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 13, Issue 3-4, Pages 403-407Publisher
SPRINGER HEIDELBERG
DOI: 10.1007/s00542-006-0224-x
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The bond strength dependence on bonding temperature and bonding pressure in traditional thermal bonding and surface modification bonding of PMMA is investigated. The results show that the bond strength of the latter bonding method is larger than the former. The effects of post-annealing and aging on bond strength are also demonstrated. Then the bonding parameters of temperature and pressure are optimized, and typical bond strength of 1 MPa is obtained at bonding temperature of 95 degrees C, bonding pressure at 2 MPa, bonding time for 3 min and 50 degrees C post-annealing for 2 h. The successful bonded microfluidic device was obtained through this optimized thermal bonding method.
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