Dielectric and thermal properties of polymer network based on bismaleimide resin and cyanate ester containing dicyclopentadiene or dipentene. III

A series of bismaleimide-triazine (BT) resins were prepared from commercial bismaleimide (DDMBMI) and 2,6-dimethylphenol-dicyclopentadiene dicyanate ester (DCPDCY) or 2,6-dimethylphenol-dipentene dicyanate ester (DPCY). The thermal properties of cured BT resins containing DCPD or DP were studied using a dielectric analyzer (DEA), dynamic mechanical analyzer (DMA), and thermal gravimetric analyzer (TGA). These data were compared with that of DDMBMI cured with bisphenol A dicyanate ester (BADCY). The cured DDMBMI/DCPDCY or DDMBMI/ DPCY exhibits a lower dielectric constant, dissipation factor, and moisture absorption than those of DDMBMI/BADCY. The effects of blend composition on the glass transition temperatures and thermal stability are discussed. (c) 2006 Wiley Periodicals, Inc.