Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 445, Issue -, Pages 620-624Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2006.09.097
Keywords
copper; polyimide; interface; strength; oxidation; degradation
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Interface adhesion strength of Cu/Cr/polyimide was measured and the effects of annealing atmosphere were investigated. Adhesion strength decreased after annealing in vacuum by 25% and in air by 41%, which was attributed, respectively, to broken carbonyl bonds and to the formation of Cr oxide. Failure mode changed accordingly from cohesive to interfacial at a Cr/polyimide interface. (c) 2006 Elsevier B.V. All rights reserved.
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