4.8 Article

Silicon carbide power MOSFET model and parameter extraction sequence

Journal

IEEE TRANSACTIONS ON POWER ELECTRONICS
Volume 22, Issue 2, Pages 353-363

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TPEL.2006.889890

Keywords

DiMOSFET; silicon carbide (SiC)

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A compact circuit simulator model is used to describe the performance of a 2-kV, 5-A 4-H silicon carbide (SiC) power DiMOSFET and to perform a detailed comparison with the performance of a Widely used 400-V, 5-A Si power MOSFET. The model's channel current expressions are unique in that they include the channel regions at the corners of the square or hexagonal cells that turn on at lower gate voltages and the enhanced linear region transconductance due to diffusion in the nonuniformly doped channel. It is shown that the model accurately describes the static and dynamic performance of both the Si and SiC devices and that the diffusion-enhanced channel conductance is essential to describe the SiC DiMOSFET on-state characteristics. The detailed device comparisons reveal that both the on-state performance and switching performance at 25 degrees C are similar between the 406-V Si and 2-kV SiC MOSFETs, with the exception that the SiC device requires twice the gate drive voltage. The main difference between the devices is that the SiC has a five times higher voltage rating without an increase in the specific on-resistance. At higher temperatures (above 100 degrees C), the Si device has a severe reduction in conduction capability, whereas the SiC on-resistance is only minimally affected.

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