☆ 4.8 Article

First-Principles Simulations of Conditions of Enhanced Adhesion Between Copper and TaN(111) Surfaces Using a Variety of Metallic Glue Materials

ANGEWANDTE CHEMIE-INTERNATIONAL EDITION (2010)

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Journal

ANGEWANDTE CHEMIE-INTERNATIONAL EDITION
Volume 49, Issue 1, Pages 148-152

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/anie.200905360

Keywords

aggregation; atomic layer deposition; copper; interfaces; surface chemistry

Categories

Chemistry, Multidisciplinary

Funding

  1. National Natural Science Foundation of China [20873127]
  2. Air Products and Chemicals, Inc.(USA)

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