4.4 Article

Surface modification of films of various high temperature resistant thermoplastics

Journal

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
Volume 21, Issue 5-6, Pages 423-439

Publisher

TAYLOR & FRANCIS LTD
DOI: 10.1163/156856107780474966

Keywords

poly(etheretherketone); poly(phenylenesulfide); liquid crystal polymer; copper foil; adhesion; surface modification; photoelectron spectroscopy

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The influence of different surface treatments on the physical and chemical surface properties of poly(etheretherketone) (PEEK), poly(phenylenesulfide) (PPS) and a liquid crystal polymer (LCP) was studied. For all the three polymers, the adhesion strength of an adhesively-bonded copper foil could be increased significantly by a chemical etching process using chromic sulphuric acid or a low pressure air-plasma treatment. However, for LCP the enhancement of adhesion by the surface treatments was lower than for the other polymers. Peel tests were employed for determining the adhesion strength of the copper foil. The physical surface properties were investigated by laser scanning microscopy (LSM). Contact-angle measurements and X-ray photoelectron spectroscopy (XPS) provided detailed information on the chemical surface properties. The detailed XPS analyses revealed different chemical mechanisms of the surface treatments depending on the polymer investigated. In all cases an incorporation of oxygen containing groups by the surface treatments was found to be responsible for a better adhesion of the copper foil on the treated polymer films compared to the untreated.

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