4.5 Article Proceedings Paper

Thermal annealing and propagation of shockley stacking faults in 4H-SiC PiN diodes

Journal

JOURNAL OF ELECTRONIC MATERIALS
Volume 36, Issue 4, Pages 318-323

Publisher

SPRINGER
DOI: 10.1007/s11664-006-0038-8

Keywords

silicon carbide; pin diode; Shockley stacking faults (SSFs); stacking fault propagation; degradation; annealing; stressing; stacking fault shrinking; electroluminescence (EL); optical beam induced current (OBIC)

Ask authors/readers for more resources

Stacking faults within 4H-SiC PiN diodes are known to be detrimental to device operation. Here, we present electroluminescence (EL) images of 4H-SiC PiN diodes providing evidence that electrically and optically stimulated Shockley stacking fault (SSF) propagation is a reversible process at temperatures as low as 210 degrees C. Optical beam induced current (OBIC) images taken following complete optical stressing of a PiN diode and that lead to a small number of completely propagated SSFs provide evidence that such defects propagate across the n-/p+ interface and continue to grow throughout the p+ layer. These observations bring about questions regarding the validity of the currently accepted driving force mechanism for SSF propagation.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.5
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available