Self-assembly of three dimensional micro mechanisms using thermal shrinkage of polyimide

This paper describes three-dimensional microstructures fabricated using a simple self-assembly process involving the thermal shrinkage of polyimide. The proposed method enables hinged structures to be automatically rotated out of the wafer plane and to remain bent without the need to use any interlocking mechanisms. The hinged structures were fabricated using surface micromachining techniques involving heating in a furnace. An increase in the bending angle due to the shrinkage of polymide was observed with increasing heating temperature, heating time, and length of the polyimide hinge. Of these three parameters, the heating time was found to be the most suitable for precise control of the bending angle. Furthermore, microcubes were fabricated by this method and the self-assembly process was successfully visualized using a CCD camera.