Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 457, Issue 1-2, Pages 120-126Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2006.12.101
Keywords
electrodeposition; Hall-Petch relationship; Cu films; nanocrystalline Cu; hydrogen
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Copper films were electrodeposited under various conditions and the relationship between the hardness and grain size of the films was investigated. The Vickers hardness depended on the processing conditions. This is because the processing conditions affected the grain size. In particular, nanocrystalline Cu film with a grain size of 31 nm was obtained by optimizing the electrodeposition conditions. The hardness of the nanocrystalline film deviated from the Hall-Petch relationship because the grain size dependence of hardness is smaller for the grain sizes of < 100 nm than those of > 100 nm. Also, the constants Hv(0) and k(Hv) in the Hall-Petch relationship for films processed with thiourea were different from those for films processed with gelatin. The differences may not be related to texture but to superabundant vacancies generated in the process of electrodeposition. (c) 2007 Elsevier B.V. All rights reserved.
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