Journal
ANALYTICAL METHODS
Volume 6, Issue 1, Pages 97-101Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c3ay41618f
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Funding
- Nord-Pas de Calais council
- Lille University
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This paper describes a novel simple and inexpensive assembly technique with highly accurate alignment of a polydimethylsiloxane (PDMS) layer on a silicon chip for hybrid microfluidic/electronic applications. It is based on strong electrostatic adhesion of a 200 mm thick and dense layer of PDMS onto a metallic cylindrical tool mechanically fixed to an optical microscope. A 2 mm hole in the tool allows precise alignment of the PDMS layer, 10 mu m from the surface, without the usage of any lubricant. The same tool is used for PDMS bonding in a well-controlled manner. This technique is compatible with wafer scale alignment. A very precise consideration of the PDMS shrinkage ratio, reduced by 50% for thin layers, enables a misalignment range of less than 1 mu m in the experiments.
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