Journal
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
Volume 38A, Issue 6, Pages 1371-1375Publisher
SPRINGER
DOI: 10.1007/s11661-007-9138-1
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This study investigated the microstructure and properties of Bi-Ag alloys, a novel Pb-free solder for high-temperature applications. The results show that Bi-Ag alloys exhibited a nonequilibrium solidification feature and a considerably large undercooling. An increase in the Ag content effectively raised the tensile strength. However, the elongation in a decreasing order was hypereutectic Bi-11Ag, pure Bi, and then eutectic Bi-2.5Ag. The fracture mode was significantly affected by microstructural characteristics and the strain rate.
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