Journal
JOM
Volume 59, Issue 7, Pages 26-31Publisher
MINERALS METALS MATERIALS SOC
DOI: 10.1007/s11837-007-0085-5
Keywords
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The impact reliability of solder joints in electronic packages is critical to the lifetime of electronic products, especially those portable devices using area array packages such as ball-grid array (BGA) and chip-scale packages (CSP). Currently, SnAgCu (SAC) solders are most widely used for lead-free applications. However BGA and CSP solder joints using SAC alloys are fragile and prone to Premature interfacial failure, especially under shock loading. To further enhance impact reliability, a family of SAC alloys doped with a small amount of additives such as Mn, Ce, Ti, Bi, and Y was developed. The effects of doping elements on drop test performance, creep resistance, and microstructure of the solder joints were investigated, and the solder joints made with the modified alloys exhibited significantly higher impact reliability.
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