Microcontact printing and selective surface dewetting for large area electronic applications

A universal microstructuring approach was developed, which facilitates the patterning of surfaces by a combination of microcontact printing (mCP) and selective surface dewetting/wetting. Self-assembled monolayers (SAMs) were patterned on glass or silicon substrates by mu CP. The regions coated by the SAMs turn hydrophobic, whereas the uncoated regions stay hydrophilic. Such functionalized surfaces facilitate selective deposition of polymers or resists. Polymethyl methacrylate and prepolymer polyurethane were selectively deposited on the hydrophilic regions of the substrate. The hydrophobic regions of the substrate stay uncoated. Subsequently, the resist was used to lift-off metallic microstructures in order to realize micro coils and electrodes for radio frequency information tags. The printed electrodes were used to define drain and source contacts of organic thin film transistors. The device characteristic of the organic transistors will be presented. (c) 2007 Elsevier B.V. All rights reserved.