☆ 4.4 Article Proceedings Paper

Advanced dicing technology for semiconductor wafer - Stealth dicing

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING (2007)

Journal

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

Volume 20, Issue 3, Pages 259-265

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

DOI: 10.1109/TSM.2007.901849

Keywords

dicing; dry processing; laser processing; system in package; thin/ultra-thin wafer

Categories

Engineering, Manufacturing Engineering, Electrical & Electronic Physics, Applied Physics, Condensed Matter

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