4.3 Article Proceedings Paper

Total-ionizing-dose effects on isolation oxides in modern CMOS technologies

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ELSEVIER
DOI: 10.1016/j.nimb.2007.03.109

Keywords

radiation; total ionizing dose; shallow trench isolation; MOS capacitors; oxide trapped charge; interface traps; shift registers; n-channel MOSFETs

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This paper presents experimental data on the total dose response of deep sub-micron bulk CMOS devices and integrated circuits. Ionizing radiation experiments on shallow trench isolation (STI) field oxide MOS capacitors (FOXCAP) indicate a characteristic build-up of radiation-induced defects in the dielectric. In this paper, capacitors fabricated with STI, thermal, SIMOX and bipolar base oxides of similar thickness are compared and show the STI oxide to be most susceptible to radiation effects. Experimental data on irradiated shift registers and n-channel MOSFETs are also presented. These data indicate that radiation damage to the STI can increase the off-state current of n-channel devices and the standby current of CMOS integrated circuits. (c) 2007 Elsevier B.V. All rights reserved.

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