Micromolding in capillaries and microtransfer printing of silver nanoparticles as soft-lithographic approach for the fabrication of source/drain electrodes in organic field-effect transistors

Within the past years there has been much effort in developing and improving new techniques for the processing of advanced functional materials used in promising applications like micro-optics or organic electronics. Much attention has been paid to solution-based techniques, which enable low-cost processing and new possible developments like flexible displays or inkjet printed electronics. An alternative approach to inkjet printing is soft-lithography, which is a collective term for a number of non-photolithographic techniques and has become an important tool for the micron-sized structuring of materials. Here we report on the use of micromolding in capillaries (MIMIC) and microtransfer printing (mu TP) as two soft-lithographic techniques for the fabrication of silver source/drain electrodes in well-performing bottom-gate/bottom-contact organic field-effect transistors (OFETs) with poly(3-hexylthiophene) as active layer material. While MIMIC combines solution-processability with high lateral resolution for highly accurate patterns, mu TP is the miniaturized counterpart to conventional letterpress printing. The performance of the OFETs fabricated with these techniques is similar to devices based on conventional gold source/drain electrodes with well-defined source-to-drain current saturation and a linear behavior at low drain voltages suggesting a low contact resistance and hence good carrier injection from the silver electrodes into the organic semiconductor. (c) 2007 Elsevier B.V. All rights reserved.