Journal
INTERNATIONAL JOURNAL OF MINERAL PROCESSING
Volume 144, Issue -, Pages 11-15Publisher
ELSEVIER
DOI: 10.1016/j.minpro.2015.09.013
Keywords
Printed circuit board assembly; Electronic components; Disassembly process; Recycling; E-wastes
Funding
- Global Excellent Technology Innovation of Korea Institute of Energy Technology Evaluation and Planning (KETEP)
- Ministry of Trade, Industry & Energy, Republic of Korea [2011T100100221]
Ask authors/readers for more resources
The current study involves the development of an electronic component (EC) disassembly apparatus for printed circuit board assembly (PCBA) in the pretreatment processing of electronic waste recycling. In the apparatus, the PCBA is fed slowly into the disassembly module and is then heated via infra-red heater over the melting point of the solder which bonds the PCB and ECs. The ECs are swept off from the PCB with the use of rotating steel brush rods. Then, the ECs on both sides of the boards are removed simultaneously. The maximum disassembly ratio (94%) is obtained at a feeding speed of 0.33 cm/s and a heating temperature of 250 degrees C. (C) 2015 Elsevier B.V. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available
Share Paper
