Journal
MATERIALS TRANSACTIONS
Volume 48, Issue 10, Pages 2795-2798Publisher
JAPAN INST METALS & MATERIALS
DOI: 10.2320/matertrans.MRP2007069
Keywords
metallic films; failure mechanism; in situ observation; three-point bending
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The deformation and failure of Cu and Cu/Ni film/substrate structure were studied by the scanning electron microscope (SEM) in situ observation under three-point bending. It was found that the rapid deformation occurred at sites near to the interface of film/substrate in Cu and Cu/Ni films. The transferring of deformation finally caused the surface wrinkle. The wrinkle stress can be expressed as sigma(f =)(w) .k(EfE(s)(2)1/3) Based on the results in mesoscale, a simple failure mechanism of films/substrate structure is suggested to understand the transferring process of deformation and failure characteristics.
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