Journal
IET MICROWAVES ANTENNAS & PROPAGATION
Volume 1, Issue 5, Pages 961-967Publisher
INST ENGINEERING TECHNOLOGY-IET
DOI: 10.1049/iet-map:20060301
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The design, fabrication and performance of a 60-GHz multi-chip module receiver employing a substrate integrated waveguide filter and antenna are presented. The receiver is integrated onto a single multilayer substrate, fabricated using photo-imageable thick-film technology. The module incorporates a GaAs monolithic microwave integrated circuit low-noise amplifier and downconverter, with lumped elements for intermediate frequency (IF) filtering embedded into the substrate. The chip cavities for mounting of the MMICs are photo-imaged as part of the standard process, giving precise dimensional control for short bond-wire lengths. The complete module including integrated antenna measures only 22.5 mm x 5.4 mm x 0.3 mm and works from 58 to 64 GHz.
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