Pattern transfer using poly(styrene-block-methyl methacrylate) copolymer films and reactive ion etching

Self-assembly block copolymers have drawn a lot of attention for its great potential on critical dimension (CD) control and line-edge roughness (LER) reduction, which become more and more crucial as the CD of transistors is only tens of nanometers nowadays. In this study, lamellar-forming poly(styrene-b-methyl methacrylate) copolymer which fabricates line patterns was chosen for its ability to provide higher aspect ratio and vertical sidewall profile in template stage, thus more suitable for the following etching process to substrate. A dry plasma etching process using pure oxygen and pure argon plasma as example chemical etching gas and physical etching gas, respectively, was studied. Etching selectivity and lateral etch rate, which are responsible for the final template height and CD loss, had been characterized on a capacitive reactive ion etching tool. The templates formed by the proposed process had high aspect ratios, excellent pattern fidelity, and low LER values. The PS lateral etch rate was small enough to provide a wide process window for retaining the CD of the pattern during the template forming process. Subsequent silicon etching using the PS template made by dry etching process yielded a steep and smooth sidewall profile. (c) 2007 American Vacuum Society.